Thanks…and Stay Tuned!
Thank you to everyone who entered and voted in this year’s contest. Watch this space for announcement of the finalists who will compete for the $25,000 Grand Prize.
Help build a better tomorrow
Since Tech Briefs magazine launched the Create the Future Design contest in 2002 to recognize and reward engineering innovation, over 15,000 design ideas have been submitted by engineers, students, and entrepreneurs in more than 100 countries. Join the innovators who dared to dream big by entering your ideas today.
Read About Past Winners’ Success Stories
Special Report spotlights the eight top entries in 2023 as well as past winners whose ideas are now in the market, making a difference in the world.
Click here to read moreA ‘Create the Future’ Winner Featured on ‘Here’s an Idea’
Spinal cord injury affects 17,000 Americans and 700,000 people worldwide each year. A research team at NeuroPair, Inc. won the Grand Prize in the 2023 Create the Future Design Contest for a revolutionary approach to spinal cord repair. In this Here’s an Idea podcast episode, Dr. Johannes Dapprich, NeuroPair’s CEO and founder, discusses their groundbreaking approach that addresses a critical need in the medical field, offering a fast and minimally invasive solution to a long-standing problem.
Listen nowThank you from our Sponsors
“At COMSOL, we are very excited to recognize innovators and their important work this year. We are grateful for the opportunity to support the Create the Future Design Contest, which is an excellent platform for designers to showcase their ideas and products in front of a worldwide audience. Best of luck to all participants!”
— Bernt Nilsson, Senior Vice President of Marketing, COMSOL, Inc.
“From our beginnings, Mouser has supported engineers, innovators and students. We are proud of our longstanding support for the Create the Future Design Contest and the many innovations it has inspired.”
— Kevin Hess, Senior Vice President of Marketing, Mouser Electronics
contest
Contest
Senior Engineer - Micron Technology Inc.
Boise, ID
Will provide later.
Principal Systems Engineer - Medrad Inc. (A Bayer Affiliate)
Indianola, PA
Sriram Sambandamurthy is a Principal Systems Engineer designing medical device products specifically RF Coils for Magnetic Resonance Imaging (MRI) scanner systems. He has a Doctoral degree with over 16 years of research and industrial experience primarily in RF, electro-magnetics, antenna design and medical device R&D. He has 1 patent publication, 2 patent applications and authored several Conference and technical publications and won numerous awards. He is passionate to create novel, innovative designs and bring conceptual ideas into products that make significant impact to the end user and played a key role in bringing numerous medical device products to the market. His skill-set includes Systems Engineering, Project Management, and Sustainability Engineering.
Senior Mechanical Team Leader - Motorola
Horsham, PA
Carl Gomes is a mechanical design engineer with several years experience using solid modeling software to design consumer electronics packaging. Experienced at electro-mechanical packaging of consumer electronics such as residential telephones, business telephones, cordless phones, cellular phones, lighting controls, telephone and cable TV outside plant equipment, and cable TV set top boxes. He's been a active member of the Society of Plastics Engineers and the American Society of Mechanical Engineers and is currently a mentor of FIRST Robotics Team 708.
Mechanical R&D Engineer - Agilent Technologies
Wilmington, DE
Rich has been working for Hewlett-Packard and then Agilent Technologies all 29 years since graduating from MIT in 1981. At home, I enjoy building rock walls, rock climbing, volunteering with Appalachia Service Project, and drinking fine wines.
Sr Escalation Engineer - Microsoft Corporation
Bellevue, WA
It has been 6.5 years for me at Microsoft, first 5 years as Embedded Engineer in Windows CE product and last 1.5 years in Windows Azure (Cloud OS) Project. I have overall 12 years experience in computer industry, in which 10 years in Embedded Softwares and about 2 years in Cloud Computing. I have extensive work experience with Embeded Silicon Vendors in Asia, i.e. Samsung, HTC, LG, ASUS, Toshiba, Casio, Sony, NEC, Hitachi, HP.
My work experience as following:
- 2004-Now - Microsoft Corporation
- 2001-2004 - ISR Corporation, Foster City USA and Tokyo Japan
- 2000-2001 - Breakaway Systems, Redwood Shores, CA
- 1999-2000 - Calsoft Corporation, San Jose, USA
I have passion for AstroPhysics and Radio Astronomy and I take some time off to fulfill my passion regularly.
Program Manager - Rockwell Automation
Milwaukee, WI
Michael is a talented and creative Marketing Professional with solid leadership skills, able to build and guide top-performing marketing teams in international settings. Adept at communicating with management, vendors, and internal departments, he has demonstrated success-driving growth in targeted markets through implementation of key projects. Michael is able to evaluate new products and companies for partnering opportunities, identify acquisition targets in support of new business initiatives with efficiency and decisiveness.
Director, IC design - Maxim Integrated Products
Sunnyvale, CA
Abraham has more than 20 years of design & application experience. He has worked in multinationals like Maxim Integrated Products, National Semiconductor as well as internet startup. This gives him a very broad vision in viewing things. His experience in the Far East, including Hong Kong & China, have enhanced his product development portfolio significantly. He is a member of IEEE & was a millenium member of Mensa.
Technical Fellow - Delphi
Kokomo, IN
BSME from General Motors Institute 1977
MS in Engineering from University of Colorado 1977
37 years experience in Manufacturing Equipment and Automation development, including robotics, machine vision, and high speed servo motion.
Experience in advanced electronics packaging development.
Senior Platform Engineer - GE Home & Business Solutions
Louisville, KY
BSME New Jersey Institute of Technology
Automotive OEM 20+ years: Powertrain Program Management, Chassis System Integration and Analysis
December 2009: General Electric Appliances Laundry System Design Engineer
Technology Specialist - Tetra Pak
Modena, Italy
I've worked, since 1997, as a Technology Specialist in Packaging Technology departement of Tetra Pak, world leader in aseptic packaging. I own several patents in the field (Patents n. EP02425003.7, EP01830392.5, EP09154474.2) and have acted as tutor for many Master Thesis in the field of Mechatronics for Packaging Machines. I also act as professor of Motion Control for Packaging Machines in Mechatronics Engineering at University of Modena and Reggio Emilia since 2002. I have been professor of Space Flight Dynamics in Aerospace Engineering at University of Bologna in Forli' from 1995 to 2002. In these years, I've written a book on the subject: "Dinamica del Volo Spaziale" edited by "Levrotto e Bella".
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